XCVM1502-2LSEVFVC1760 System On Chip (SoC)_Electronic components_ Integrated circuit IC_ Semiconductor components_ Equipment procurement_ EIS LIMITED

Part number：

XCVM1502-2LSEVFVC1760

Product classification：

System On Chip (SoC)

Manufacturer：

Xilinx (AMD)

Description：

IC VERSALPRIME ACAP FPGA 1760BGA

Encapsulation：

Packing：

Tray

Quantity：

RoHS status：

YES

TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ Prime
Package	Tray
Product Status	ACTIVE
Package / Case	1760-BFBGA, FCBGA
Speed	450MHz, 1.08GHz
RAM Size	256KB
Operating Temperature	0°C ~ 110°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ Prime FPGA, 1M Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	1760-FCBGA (40x40)
Architecture	MPU, FPGA

TYPE

DESCRIPTION

Mfr

Xilinx (AMD)

Series

Versal™ Prime

Package

Tray

Product Status

ACTIVE

Package / Case

1760-BFBGA, FCBGA

Speed

450MHz, 1.08GHz

RAM Size

256KB

Operating Temperature

0°C ~ 110°C (TJ)

Core Processor

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Primary Attributes

Versal™ Prime FPGA, 1M Logic Cells

Connectivity

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Peripherals

DDR, DMA, PCIe

Supplier Device Package

1760-FCBGA (40x40)

Architecture

MPU, FPGA